Instructions:
VCP isdesigned to replace traditional copper plating equipment,
it cansolve the problems of falling bar and chemicals polluted.
Thedouble track design can improve the capacity significantly,
VCPtakes up less space, aggressive price and small running cost;
theequipment is easy to operate and maintain. With PC automatic
monitoringand control system, it is applicable to copper plating processes
of PCB,excellent uniformity of copper plating even through
holes/blindvia plating.
Capacity Planning:
The VCPcan be designed based on the customer’s process and
capacityrequirement.
Equipment Description:
Panelsize: 24 “x24” (Max.), 9.8 “x11.8”(Min.)
Panelthickness: 0.06mm ~ 3.2mm
Linespeed: 0.4 ~ 1.5m/min (adjustable)
Theshortest cycle: 25 seconds
Effectiveplating window: 610x3000 (mm) x5x2 (double slots)
Currentdensity: 35ASF (Max.)
AnodeType: titanium basket soluble phosphorus copper balls or
insolubleanode (iridium oxide anode)
CathodeType: Single trap double-track splint system
Capacity:220,000 SF per month (plate size 24 “x18”)
Standardplating thickness: 20um
Standardcurrent density: 2.5A/dm2
Workinghour: 22hrsx26days = 572hrs/month
Secondlayer blind via
ViaDiameter/Depth=7mil/4mil
TP(min)=90%
Pluggedhole plating
Via Diameter/Depth=4mil/3mil
Fill-upRatio=95%
Throughhole plating
Depth/Hole Diameter
=5mm/0.4mm
TP(min)=73%
Blindvia plating
Via Diameter/Depth=4.5mil/3mil
TP(min)=99%
Paneldistribution
